Product Description
Introduction of bakelite powder
Bakelite powder also called phenolic molding compound , has good electrical insulation and high temperature resistant performance, used in the manufacture of electronic appliances and daily-use industrial products, and automotive parts. Is mainly based on wood flour for the filling of phenolic plastic, after molding (injection molding, die casting, transfer molding) into a product.
Technical Properties
Property | Test Method | Value | Unit |
Relative Density | GB/T1033.1-2008 | ≤1.4 | G/CM3 |
Volume resistivity | GB/T1410-2006 | ≥1012 | Ω*cm |
Flexural strength | GB/T9341-2000 | ≥80 | MPa |
Charpy Impact Strength | GB/T1043.1-2008 | ≥4.5 | KJ/M2 |
Charpy Notched Impact Strength | GB/T1043.1-2008 | ≥1.7 | KJ/M2 |
Temp.of deflection under load | GB/T1634.2-2004 | ≥160 | °C |
Insulation Resistance | GB/T1410-2006 | ≥1011 | Ω |
Electric strength | GB/T1408.1-2006 | ≥10 | KV/mm |
Dissipation factor | GB/T1409-2006 | ≤0.05 | - |
Moulding Shrinkage | ISO2577:1984 | 0.5-0.8 | % |
Water absorption | GB/T1034-2008 | ≤40 | mg |
Remark: Flowability and shrinkage will be agreed between seller and buyer. |
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| Preheating temperature | Preheating time | Mold temperature | Molding pressure | Curing time | 80-120°C | 5-15min | 160-180°C | 25-35MPa | 1min/mm |
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Packaging & Shipping
Package and storage
Packed in kraft paper or woven bag with plastic inner of 25 kg net for dampproof. The type, batch number, weight and production date are marked on the bags. Avoid being heated or affected with damp. Don't put it in the place near fire and out of sunlight. Keep in well-ventilated and dry place. The storage life is one year. If it is out of the storage limitation, the tests should be done and the qualified product can still be used.
Delivery Detail:Within 15 days shipping